* Meet RoHS request and pass SGS certificate
* High bond strength & good dimensional stability
* Excellent electrical properties & solderability
* Good chemical resistance to process chemicals & solvents.
* Data communication, avionics, aerospace, defense, PC and
automotive fields, and etc.
* Base film: PI
* Base thickness: 0.5~2.0 mil.
* Copper: EDHD/RA 12~70um
* Adhesive: 0.5 ~ 0.7 mil.
* Laminate structure: Single/Double sided
For more details, please don't hesitate to touch us by phone, fax