* High peel strength
* Minimal resin flow, flexible and less resin dust
* Excellent thermal reliability and electrical properties
* Excellent mechnical processability, punching process applicable
* Suitable for bonding used in die cavity board and multilayer
rigid-flex PCB application, etc.
* Base thickness: 0..05~0.21mm
* Width: 1270mm
* Base: Natural, Yellow
* Fabric type: 106/1080/2313/2116/1506/7628
For more details, please don't hesitate to touch us by phone, fax
or email in time.